Presentation
| Product type | BGA Underfill CPU Epoxy Adhesive |
Sale package
| Pack | Blister |
| Content | BGA Underfill CPU Epoxy Adhesive |
| Product status | New |
Wylie CPU Underfill BGA Epoxy Adhesive
for Apple iPhone
Wylie Epoxy BGA Underfill CPU Underfill Epoxy Adhesive is the ideal solution for professional repairs of Apple iPhone components.
Specifically designed to provide a robust and durable support, this adhesive is used to strengthen the bonds between the BGA chipset and the PCB (motherboard),
reducing the risk of damage caused by mechanical shock or temperature variations. An essential product for GSM repair technicians,
ensuring performance and reliability in high precision interventions.
Features:
High compatibility: Designed specifically for Apple iPhone devices
Superior protection: Prevents cracks and detachments in BGA and PCB components
Excellent durability: Epoxy formula provides strong adhesion and long-term durability
Precise application: Easy to use due to optimized design for detailed repairs